Qualcomm supports “targeted and rule-based export controls” as one of several long-term federal policy recommendations for curing the semiconductor shortage, it said in comments posted Wednesday in docket BIS-2021-0036. Submissions were due Nov. 8 in the Bureau of Industry and Security's request for information to help the secretaries of Commerce and Homeland Security prepare a report to the White House on the chip crunch by the one-year anniversary of President Joe Biden’s Feb. 24 executive order (see 2109230038).
The U.S. announced new, coordinated sanctions this week against a virtual currency exchange for processing ransomware-related transactions, and designated several companies and people for supporting the exchange and “perpetuating” ransomware attacks in the U.S. The Treasury Department’s Financial Crimes Enforcement Network also updated its ransomware payment advisory, which includes new information on ransomware trends.
The industry shipped more semiconductor units in Q3 than during any previous quarter on record, ramping up production to mitigate the global chips crunch, reported the Semiconductor Industry Association Monday. Global sales of $144.8 billion were up 27.6% year over year and 7.4% higher sequentially, said SIA. Year-over-year Q3 sales increased 33.5% in the Americas, and were up 32.3% in Europe, 27.2% in Asia Pacific, 24.5% in Japan and 24% in China, it said.
The industry shipped more semiconductor units in Q3 than during any previous quarter on record, ramping up production to mitigate the global chips crunch, reported the Semiconductor Industry Association Monday. Global sales of $144.8 billion were up 27.6% year over year and 7.4% higher sequentially, said SIA. Year-over-year Q3 sales increased 33.5% in the Americas, and were up 32.3% in Europe, 27.2% in Asia Pacific, 24.5% in Japan and 24% in China, it said.
New draft text of Congress’ Build Back Better Act budget reconciliation bill includes a tax credit to incentivize advanced semiconductor manufacturing, which would help “strengthen” U.S. supply chains, the Semiconductor Industry Association said Oct. 28. The incentive, included in the reconciliation package released by congressional Democrats Oct. 28, would create an investment tax credit of up to 25% for certain “advanced manufacturing facilities” and a tax credit for certain “eligible components.” The credit would specifically be available for “property for the manufacturing of semiconductors and semiconductor tooling equipment” that begins construction before 2027. The package hasn’t yet received a vote.
New draft text of the congressional budget reconciliation bill includes a tax credit to incentivize advanced semiconductor manufacturing to help “strengthen” U.S. supply chains, said the Semiconductor Industry Association Thursday. The incentive, included in the reconciliation package released Thursday by congressional Democrats, would create an investment tax credit of up to 25% for advanced manufacturing facilities and for eligible components. It would apply to plants that begin construction before 2027. The credit “would help keep America on top in this foundational technology and strengthen U.S. chip supply chains by boosting domestic semiconductor production and innovation,” said Qorvo CEO Bob Bruggeworth, who chairs SIA's board. The credit was originally part of the Facilitating American-Built Semiconductors (Fabs) Act introduced in June. SIA President John Neuffer said fully funding the Chips Act would "turbocharge American leadership in the game-changing technologies of today and tomorrow.”
Global semiconductor sales increased 29.7% year over year in August to $47.2 billion, and were up 3.3% from July, reported the Semiconductor Industry Association Monday. “Chip shipments have reached record totals in recent months as the industry ramps up production to address continuing high demand,” said CEO John Neuffer. Year-over-year sales increased 33.5% in Europe, and were up 30.8% in China, 30.6% in the Americas, 28.2% in Asia Pacific and 23.8% in Japan.
The U.S. and EU should maintain “close coordination” and an “exchange of information” on semiconductor policy and strategy to bolster resilience of the semiconductor supply chains in both regions, blogged Jennifer Meng, Semiconductor Industry Association global policy manager, and Meghan Biery, the association’s director-global technology and security policy. “While geographic specialization has served the global semiconductor industry and its consumers well,” they said Tuesday, “it has also created potential vulnerabilities in the global value chain.” Governments in both regions are trying to introduce and implement policies to encourage investment in “high-risk gaps in the supply chains and to establish a more geographically diverse supplier base,” they said. The U.S. and EU should “jointly analyze the combined strengths and weaknesses” of those policies to ensure “each region’s respective incentive programs are open to the most globally innovative companies,” they said. Promoting information sharing and transparency about each region’s incentive programs can help build supply chain resilience, they said. The inaugural meeting of the U.S.-EU Trade and Technology Council convened in Pittsburgh beginning Wednesday with the goal of expanding and deepening trade and transatlantic investment ties, they said. Chips should top the U.S-EU trade partnership "agenda" in Pittsburgh, blogged Al Thompson, Intel vice president-U.S. government relations, and Fernando Loureiro, Intel senior director-government director, Europe, the Middle East and Asia. Expanding "advanced semiconductor capabilities" will offer Europe and the U.S. "their best chance to reduce dependency on imports from Asia and elsewhere and re-establish themselves as major producers of computer chips," they said Tuesday. The EU and the U.S. "used to be global leaders in the semiconductor industry," they said. "With political and industry forces aligning to reinstate that leadership, we look forward to seeing the progress made in Pittsburgh this week and beyond."
The U.S. and EU should maintain “close coordination” and an “exchange of information” on semiconductor policy and strategy to bolster resilience of the semiconductor supply chains in both regions, blogged Jennifer Meng, Semiconductor Industry Association global policy manager, and Meghan Biery, the association’s director-global technology and security policy. “While geographic specialization has served the global semiconductor industry and its consumers well,” they said Tuesday, “it has also created potential vulnerabilities in the global value chain.” Governments in both regions are trying to introduce and implement policies to encourage investment in “high-risk gaps in the supply chains and to establish a more geographically diverse supplier base,” they said. The U.S. and EU should “jointly analyze the combined strengths and weaknesses” of those policies to ensure “each region’s respective incentive programs are open to the most globally innovative companies,” they said. Promoting information sharing and transparency about each region’s incentive programs can help build supply chain resilience, they said. The inaugural meeting of the U.S.-EU Trade and Technology Council convened in Pittsburgh beginning Wednesday with the goal of expanding and deepening trade and transatlantic investment ties, they said. Chips should top the U.S-EU trade partnership "agenda" in Pittsburgh, blogged Al Thompson, Intel vice president-U.S. government relations, and Fernando Loureiro, Intel senior director-government director, Europe, the Middle East and Asia. Expanding "advanced semiconductor capabilities" will offer Europe and the U.S. "their best chance to reduce dependency on imports from Asia and elsewhere and re-establish themselves as major producers of computer chips," they said Tuesday. The EU and the U.S. "used to be global leaders in the semiconductor industry," they said. "With political and industry forces aligning to reinstate that leadership, we look forward to seeing the progress made in Pittsburgh this week and beyond."
The U.S. semiconductor industry maintained global leadership, with 47% revenue share, and “kept steady” its high R&D investment at $44 billion spent through 2020, reported the Semiconductor Industry Association Monday. But the industry “and its position as a global innovation leader face myriad challenges,” it said. “The industry continues to grapple with a widespread global semiconductor shortage brought on by unpredictable and increased demand resulting from the COVID-19 pandemic,” said SIA. It suffers from “decreasing share of global front-end fab capacity fueled by incentives and subsidies provided by foreign governments that far outstrip similar incentives in the U.S.,” it said. “America’s economy, national security, tech leadership, and response to COVID-19 are built on semiconductors,” said SIA CEO John Neuffer. “To remain competitive on the global economic stage” and promote more R&D and production “on U.S. shores,” Congress and the White House should “act swiftly” to fund the semiconductor provisions in the Chips Act, he said. The Senate has passed legislation that provides $52 billion in funding, and the House needs to “follow suit,” said SIA.