ITC Votes to Institute Investigation on Integrated Circuit Packages
The International Trade Commission voted to institute an investigation of certain integrated circuit packages provided with multiple heat-conducting paths and products containing same (337-TA-851). The products at issue in this investigation are IC chips incorporated into, for example, televisions.
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The investigation is based on a complaint filed by Industrial Technology Research Institute of Taiwan and ITRI International of San Jose, CA, on May 31. The complaint alleges violations of section 337 of the Tariff Act of 1930 in the import into the U.S. and sale of integrated circuit packages provided with multiple heat-conducting paths and products containing same that infringe a patent asserted by the complainants. The complainants request that the ITC issue an exclusion order and a cease and desist order.
The ITC has identified the following as respondents in this investigation:
- LG Electronics, Inc., of the Republic of Korea
- LG Electronics, U.S.A., Inc., of Englewood Cliffs, NJ
(See ITT's Online Archives 12060118 for summary of the original complaint, and 12060529 for summary of ITC's request for comments relating to the complaint.)