ITC Patent Complaint Filed on Integrated Circuit Packages
According to the International Trade Commission, a section 337 patent complaint on certain integrated circuit packages provided with multiple heat-conducting paths and products containing same was filed on behalf of Industrial Technology Research Institute and ITRI International on May 31, 2012. The proposed respondents are:
Sign up for a free preview to unlock the rest of this article
Communications Daily is required reading for senior executives at top telecom corporations, law firms, lobbying organizations, associations and government agencies (including the FCC). Join them today!
- LG Electronics Inc., South Korea
- LG Electronics USA, Inc., Englewood Cliffs, New Jersey
(D/N 2899, Received 05/31/12)
*Corrected 06/05/12 to reflect the correct the name of the proceeding